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| EMP114-Q5 UPDATED: 04/24/2008 7.0 - 9.0 GHz Surface-Mounted PA FEATURES * * * * * * 7.0 - 9.0 GHz Operating Frequency Range 30.0dBm Output Power at 1dB Compression 17.0 dB Typical Small Signal Gain -40dBc OIMD3 @Each Tone Pout 20dBm APPLICATIONS Point-to-point and point-to-multipoint radio Military Radar Systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25 C, 50 ohm, VDD=7V, IDQ=800mA) SYMBOL F P1dB Gss OIMD3 Input RL Output RL Idss VDD Rth Tb PARAMETER/TEST CONDITIONS Operating Frequency Range Output Power at 1dB Gain Compression Small Signal Gain Output 3rd Order Intermodulation Distortion @f=10MHz, Each Tone Pout 20dBm Input Return Loss Output Return Loss Saturate Drain Current Power Supply Voltage Thermal Resistance 1 MIN 7.0 28.5 15.0 TYP MAX 9.0 UNITS GHz dBm dB 30.0 17.0 -40 -12 -5 -37 dBc dB dB VDS =3V, VGS =0V 990 1230 7 10 1400 8 o mA V C/W C Operating Base Plate Temperature -35 +85 ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION2,3 SYMBOL VDS VGS IDD IGSF PIN TCH TSTG PT CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation CONTINUOUS 8V -4 V Idss 18mA @ 3dB compression 150C -65/150C 12.0W 1. Rth is mounting dependent. Measured result when used with Excelics recommended evaluation board. 2. Operating the device beyond any of the above rating may result in permanent damage. 3. Bias conditions must also satisfy the following equation VDS*IDS < (TCH -THS)/RTH; where THS = ambient temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 3 May 2008 EMP114-Q5 UPDATED: 04/24/2008 7.0 - 9.0 GHz Surface-Mounted PA CHIP OUTLINE AND PIN ASSIGNMENT Top View 0.1970.002 0.1970.002 Bottom View 16 20 EMP114 -Q5 0 REF 0.1970.002 0.049 MAX 0.008 0 REF 0 REF 0.164 15 1 0.042 0.034 0.016 0 REF 11 5 10 6 0.0260.002 0.0120.002 Additional Notes: 1) Ground Plane must be soldered to PCB RF ground 2) All dimensions are in inches 3) Refer to Excelics application notes on QFNs for further guidelines 4) Pin Assignment: Top View Vd1 Vd2 Bottom View Vd2 16 Vd1 20 RFin EMP114 -Q5 Vg 15 1 RFout RFout RFin 11 5 10 6 Vg Pin 1, 2, 4, 5 3 6 7, 8, 9, 10, 11, 12, 14, 15 13 16 17, 18, 19 20 Assignment NC RFin Vg NC RFout Vd2 NC Vd1 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 3 May 2008 EMP114-Q5 UPDATED: 04/24/2008 7.0 - 9.0 GHz Surface-Mounted PA Recommended Circuit Schematic: Vd 22uF 0.1uF 0.1uF 22uF Vd Vd1 NC NC NC NC NC Vd2 NC NC RFin NC NC EMP114 -Q5 Vg NC NC NC NC RFout NC NC Vg 22uF 0.1uF Notes: 1) External bypass capacitors should be placed as close to the package as possible. 2) Dual biasing sequence required: a. Turn-on Sequence: Apply Vg = -2.5V, followed by Vd = 7V, lastly increase Vg until required Idq b. Turn-off Sequence: Turn off Vd, followed by Vg 3) Demonstration board available upon request. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 3 May 2008 |
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